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8810F Ultra-High Current Nano2 Fast Blow Subminiature SMD Chip Fuse 7.3x5.8x4.2mm 60A 70A 80A 100A 125A 125V Max.
Product Details:
| Place of Origin: | Dongguan,China |
| Brand Name: | AMPFORT |
| Certification: | UR |
| Model Number: | 8810F |
Payment & Shipping Terms:
| Minimum Order Quantity: | 1000pcs |
|---|---|
| Price: | 0.5~0.7 USD/PC |
| Packaging Details: | T/R,1K/REEL |
| Delivery Time: | 7 workdays |
| Payment Terms: | T/T |
| Supply Ability: | 200,000PCS PER DAY |
|
Detail Information |
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| Name: | Chip Fuse | Dimension: | 7.3x5.8x4.2mm |
|---|---|---|---|
| Operating Temperature: | -55~+125C | Rated Voltage: | 24V~125V |
| Rated Current: | 20A~125A | Speed: | Fast Acting |
| Mounting Type: | Surface Mount | Fuse Type: | Board Mount (Cartridge Style Excluded) |
| Case: | 2-SMD, J-Lead | HTSUS: | 8536.10.0040 |
| ECCN: | EAR99 | RoHS Status: | ROHS3 Compliant |
Product Description
8810F Ultra-High Current Nano2 Fast Blow Subminiature SMD Chip Fuse 7.3x5.8x4.2mm 60A 70A 80A 100A 125A 125V Max.
Description Of The Subminiature SMD Chip Fuse
This high-current SMD fuse is a small, square, surface mount fuse that is designed as supplemental overcurrent protection for high-current circuits in various applications.
Ordering Info Of The Subminiature SMD Chip Fuse
| Part | Ampere | Voltage | Breaking |
| No. | Rating | Rating | Capacity |
| RM.8810F.20 | 20A |
125V/120V/100V/85V/80V/ 75V/72V/63V/58V/48V/32V |
1500A@24V32V48V58V63V72V75V85VDC, 1000A@100VAC,300A@125V120V115V DC |
| RM.8810F.25 | 25A | ||
| RM.8810F.30 | 30A | ||
| RM.8810F.32 | 32A | ||
| RM.8810F.35 | 35A | ||
| RM.8810F.40 | 40A | ||
| RM.8810F.45 | 45A | ||
| RM.8810F.50 | 50A | ||
| RM.8810F.60 | 60A | ||
| RM.8810F.70 | 70A | ||
| RM.8810F.80 | 80A | ||
| RM.8810F.100 | 100A | ||
| RM.8810F.125 | 125A |
Product Characteristics Of The Subminiature SMD Chip Fuse
|
NO. |
Item |
Content |
Reference standards |
| 1 |
Product Marking |
Brand, Ampere Rating | Marking standards |
| 2 |
Operating Temperature |
-55°C to 125°C | –55ºC to 125ºC with proper derating |
| 3 |
Solderability |
T=240°C±5°C , t=3sec±0.5sec, Coverage≥95% | MIL-STD-202, Method 208 |
| 4 |
Resistance to Soldering Heat |
10 sec at 260°C | MIL-STD-202, Method 210, Test condition B |
| 5 |
Insulation Resistance (after Opening) |
10,000 ohms minimum | MIL-STD-202, Method 302, Test Condition A |
| 6 |
Thermal Shock |
5 cycles, -65°C / +125°C, 15 minutes at each extreme | MIL-STD-202, Method 107, Test Condition B |
| 7 |
Mechanical Shock |
100G’s peak for 6 milliseconds, 3cycles | MIL-STD-202, Method 213, Test I |
| 8 |
Vibration |
0.03”amplitude, 10-55 Hz in 1 min. 2hrs each XYZ=6hrs | MIL-STD-202, Method 201 |
| 9 |
Moisture Resistance |
10 cycles | MIL-STD-202, Method 106 |
| 10 |
Salt Spray |
5% salt solution, 48hrs | MIL-STD-202, Method 101, Test Condition B |
Typical Application Of The Subminiature SMD Chip Fuse
• Storage system power
• Cooling fan system for PC server
• Voltage regulator module
• Base station power supply
• Voltage regulator module for PC server
• High end servers / Blade computing
• Blade Servers
• Routers
• Drones
• Battery and BMS
• Telecom DC/AC Power
• Uninterrupted Power supply (UPS)
• High-power Battery Systems
• Power Factor Correction (PFC) in high wattage power supplies
• Power Distribution Units (PDUs)
• Industrial tools
• Battery Management System
Features Of The Subminiature SMD Chip Fuse
• Small size with high interrupting
• Low DCR, lower power dissipation
• Faster blow when fault condition happens
• Higher reliability standards refer to automotive items
• Fast acting
• Surface mount high current fuse
• Higher voltage rating up to 125VDC
• 7.3mm×5.8mm×4.2mm rectangle shape surface mount
• -55°C to 125°C Operating temperature
• Excellent environmental integrity
• Enhanced thermal cycling endurance
• RoHS compliant
• Halogen Free
• Pb Free
Benefits Of The Subminiature SMD Chip Fuse
• Single fuse solution for high current application requirements. Parallel fusing or use of over specked industrial type fuses can be avoided
• High wattage equipment can be designed with less board space reserved for protection components
• Relatively high interrupting rating will suit a wide variety of applications
• Guaranteed protection against overload and short circuit events in applications
• Enhance power efficiency by optimized thermal performance and minimizing power loss
• Applicable to a wide range and harsh operating environment
• Enhanced reliability and less susceptible to temperature cycling and vibration effects
• Environmental friendly and harmless to human
• Compatible with high volume assembly (Pick-and-place) requirements with the SMD configuration
Do you have selection table for customers ?
